Mission-critical liquid cooling for AI infrastructure.
We engineer, maintain, and repair the hydronic loops powering the next generation of dense compute. When flows drop or temperatures rise, we are on-site in under four hours — anywhere in our service map.
Why DataCenter.plumbing
Air-cooled habits don't survive a 130kW rack.
GPU thermal loads have outpaced traditional mechanical contractors. We're a focused crew of hydronic engineers and field technicians who live inside CDUs, manifolds, and quick-disconnect fittings — and we speak the language of data center operations.
Uptime-first response
2 to 4 hour SLA for leak containment, pump trips, CDU failover, and ΔT/ΔP excursions. We carry spare manifolds, QDs, and pumps in every truck.
AI-density expertise
Direct-to-chip and rear-door heat exchangers for H100, GB200, and MI300X clusters. Glycol management, water treatment, and dielectric fluid handling.
Designed to scale
Loop architecture sized for AI factory expansion: secondary loop sizing, manifold routing, expansion tanks, redundancy and heat-reuse interfaces.
Capabilities
Specialized hydronic services
24/7 Emergency Response
Guaranteed on-site arrival for leak mitigation, pump failure, and manifold pressure drops in high-density environments.
Design & Consulting
Secondary loop sizing, CDU placement, manifold routing, and retrofits for NVIDIA Blackwell and H100 clusters.
Hydronic Academy
Certification for data center technicians on hydronic safety, glycol management, and leak detection protocols.
Fittings · QDs · Manifolds
Every joint is a single point of failure. We treat it that way.
Blind-mate couplings, dripless quick-disconnects, and brass manifold assemblies installed and pressure-tested with documented torque, fluid chemistry, and leak-down records. Every connection traceable.
0
Class-1 leaks
14k+
Fittings live
100%
Documented
By the numbers
Scoped to hyperscale. Operated to a craftsman's standard.
4.2MW
Cooled capacity
99.99%
Thermal uptime
180m
Avg. response time
14k
Manifold fittings
Field guides
Ten deep guides from the people who plumb AI.
Long-form, engineer-written references covering direct-to-chip cooling, CDUs, GB200 spec, heat reuse and more.
Liquid cooling for data centers
A field-tested guide to liquid cooling in AI data centers: architectures, ΔT budgets, CDUs, manifolds, coolants and retrofit paths.
Direct-to-chip liquid cooling
How direct-to-chip (DLC) cold-plate cooling works for GPUs, the leak modes we see in the field, and what to specify on new AI clusters.
Rear door heat exchangers (RDHx)
Passive vs. active rear door heat exchangers, sizing rules for 40–80 kW racks, and how RDHx complements direct-to-chip loops.
Coolant Distribution Units (CDU)
How to size CDUs for AI clusters — L2L vs L2A, N+1 pump redundancy, secondary loop volume, and the failover drills that matter.
Immersion vs direct-to-chip cooling
A head-to-head on single-phase immersion and direct-to-chip cooling: TCO, service model, density limits and dielectric fluid handling.
Water Usage Effectiveness (WUE)
How to measure, report and cut WUE in AI data centers — dry coolers, adiabatic assist, closed-loop reuse and regulatory reporting.
NVIDIA GB200 NVL72 cooling requirements
Supply temps, flow rates, manifold spec and CDU sizing for GB200 NVL72 racks — from a crew that has commissioned them.
Hydronic loop design for AI data centers
Secondary loop architecture for 100 kW+ racks: pipe sizing, ΔT/ΔP budgets, expansion volume, air separation and commissioning gates.
Data center heat reuse
District heating, greenhouses and industrial process heat off warm-water AI loops — economics, interfaces and regulatory shortcuts.
PG25 glycol vs water
How to pick between demineralised water and propylene glycol blends for AI hydronic loops — freeze, viscosity, biofouling and warranty.
Need immediate hydronic support?
Critical leak response, pump diagnostics, and pressure stabilization. Engineers en route in under 4 hours.